
Ceramic Housing
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Technical
- Leak rate ::≤1×10-9 Pam3/s
- Flatness of copper surface:≤0.005mm
- Pull test:≥5KN/cm2
- Plating thickness:2-7μ
- Parallelism between copper surfaces:≤0.03mm
- Concentricity between flange and copper:≤0.5mm
- Temperature cycling:-65℃~200℃ 5circles
Main material
- Ceramic:93.5%min AL2O3
- Flange:TU1(OFHC·Cu)or Ni42Fe58 Alloy
- Glaze:Color white ,T ≥14 0℃
- Copper contact:TU1(OFHC·Cu)
- Solder:Ag72Cu28 Alloy
- Gate tube:TU1(OFHC·Cu)or Ni42Fe58 Alloy
Ceramic housing Stud and Capsule type for SCR and Recitifier Diode
Size:1" -5“
Size:1" -5“
For more information about Ceramic Housing please download the PDF file above named " Ceramic Housing and Module Parts Brief_YZPST "
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