Technical
- Leak rate ：：≤1×10-9 Pam3/s
- Flatness of copper surface：≤0.005mm
- Pull test：≥5KN/cm2
- Plating thickness：2-7μ
- Parallelism between copper surfaces：≤0.03mm
- Concentricity between flange and copper：≤0.5mm
- Temperature cycling：-65℃～200℃ 5circles
PRODUCT VISUAL01 / GALLERY
POWER COMPONENT
Ceramic Housing
✓Technical product information✓Application-focused selection support✓Catalog and requirement-based inquiry
Emailinfo@yzpst.net
Phone+86 138 0527 8321
Tip: include the part number, target voltage/current and application environment.
DOCUMENT CENTER
Downloads & technical files
http://www.youtube.com/channel/UCZ3mV8GmGNcX4WcYEoWX-_g/featured
Main material
- Ceramic：93.5%min AL2O3
- Flange：TU1(OFHC·Cu)or Ni42Fe58 Alloy
- Glaze：Color white ,T ≥14 0℃
- Copper contact：TU1(OFHC·Cu)
- Solder：Ag72Cu28 Alloy
- Gate tube：TU1(OFHC·Cu)or Ni42Fe58 Alloy
Ceramic housing Stud and Capsule type for SCR and Recitifier Diode
Size:1" -5“
Size:1" -5“
For more information about Ceramic Housing please download the PDF file above named " Ceramic Housing and Module Parts Brief_YZPST "
No additional product content is available.
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