YZPST-RGN700C29D8
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Key performance parameters at Tj = 25 °C
Parameter |
Value |
Unit |
VDS,max |
700 |
V |
RDS(on),max @ VGS = 6 V |
80 |
mΩ |
QG,typ @ VDS = 400 V |
6.2 |
nC |
ID,pulse |
58 |
A |
QOSS @ VDS = 400 V |
60 |
nC |
Qrr @ VDS = 400 V |
0 |
nC |
Maximum ratings at Tj = 25 °C unless otherwise specified
Parameter |
Symbol |
Values |
Unit |
Note/Test Condition |
Drain source voltage |
VDS,max |
700 |
V |
VGS = 0 V, Tj = -55 °C to 150 °C |
Drain source voltage transient 1 |
VDS,transient |
800 |
V |
VGS = 0 V |
Drain source voltage, pulsed 2 |
VDS,pulse |
750 |
V |
Tj = 25 °C; total time < 10 h |
Tj = 125 °C; total time < 1 h |
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Continuous current, drain source |
ID |
29 |
A |
Tc = 25 °C |
Pulsed current, drain source 3 |
ID,pulse |
58 |
A |
Tc = 25 °C; VGS = 6 V; tPULSE = 10 µs |
Pulsed current, drain source 3 |
ID,pulse |
29 |
A |
Tc = 125 °C; VGS = 6 V; tPULSE = 10 µs |
Gate source voltage, continuous |
VGS |
-6 to +7 |
V |
Tj = -55 °C to 150 °C |
Gate source voltage, pulsed |
VGS,pulse |
-20 to +10 |
V |
Tj = -55 °C to 150 °C; tPULSE = 50 ns, f = 100 kHz; open drain |
Power dissipation |
Ptot |
188 |
W |
Tc = 25 °C |
Operating temperature |
Tj |
-55 to +150 |
。C |
|
Storage temperature |
Tstg |
-55 to +150 |
。C |
Thermal characteristics
Parameter |
Symbol |
Values |
Unit |
Note/Test Condition |
Thermal resistance, junction-ambient |
RthJA |
33.6 |
°C/W |
|
Thermal resistance, junction-case |
RthJC |
0.52 |
°C/W |
|
Maximum reflow soldering temperature |
Tsold |
260 |
°C |
MSL3 |
Electric characteristics at Tj = 25 °C, unless specified otherwise
Parameter |
Symbol |
Values |
Unit |
Note/Test Condition |
||
Min. |
Typ. |
Max. |
||||
Gate threshold voltage |
VGS(th) |
1.2 |
1.7 |
2.5 |
V |
ID = 30.7 mA; VDS = VGS ; Tj = 25 °C |
- |
1.6 |
- |
ID = 30.7 mA; VDS = VGS ; Tj = 150 °C |
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Drain-source leakage current |
IDSS |
- |
5 |
65 |
µA |
VDS = 700 V; VGS = 0 V; Tj = 25 °C |
- |
13 |
390 |
VDS = 700 V; VGS = 0 V; Tj = 150 °C |
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Gate-source leakage current |
IGSS |
- |
163 |
- |
µA |
VGS = 6 V; VDS = 0 V |
Drain-source on-state resistance |
RDS(on) |
- |
60 |
80 |
mΩ |
VGS = 6 V; ID = 8 A; Tj = 25 °C |
- |
135 |
- |
mΩ |
VGS = 6 V; ID = 8 A; Tj = 150 °C |
||
Gate resistance |
RG |
- |
3 |
- |
Ω |
f = 5 MHz; open drain |
Dynamic characteristics
Parameter |
Symbol |
Values |
Unit |
Note/Test Condition |
||
Min. |
Typ. |
Max. |
||||
Input capacitance |
Ciss |
- |
225 |
- |
pF |
VGS = 0 V; VDS = 400 V; f = 100 kHz |
Output capacitance |
Coss |
- |
70 |
- |
pF |
VGS = 0 V; VDS = 400 V; f = 100 kHz |
Reverse transfer Capacitance |
Crss |
- |
0.5 |
- |
pF |
VGS = 0 V; VDS = 400 V; f = 100 kHz |
Effective output capacitance, energy related 1 |
Co(er) |
- |
105 |
- |
pF |
VGS = 0 V; VDS = 0 to 400 V |
Effective output capacitance, time related 2 |
Co(tr) |
- |
150 |
- |
pF |
VGS = 0 V; VDS = 0 to 400 V |
Output charge |
QOSS |
- |
60 |
- |
nC |
VGS = 0 V; VDS = 0 to 400 V |
Turn-on delay time |
td(on) |
- |
3 |
- |
ns |
VDS = 400 V; ID = 16 A; L = 318 µH; VGS = 6 V; Ron = 10 Ω; Roff = 2 Ω; See Figure 22 |
Turn-off delay time |
td(off) |
- |
5 |
- |
ns |
|
Rise time |
tr |
- |
4 |
- |
ns |
|
Fall time |
tf |
- |
4 |
- |
ns |
Gate charge characteristics
Parameter |
Symbol |
Values |
Unit |
Note/Test Condition |
||
Min. |
Typ. |
Max. |
||||
Gate charge |
QG |
- |
6.2 |
- |
nC |
VGS = 0 to 6 V; VDS = 400 V; ID = 8 A |
Gate-source charge |
QGS |
- |
0.5 |
- |
nC |
|
Gate-drain charge |
QGD |
- |
2.2 |
- |
nC |
|
Gate plateau Voltage |
VPlat |
- |
2.2 |
- |
V |
VDS = 400 V; ID = 8 A |
Reverse conduction characteristics
Parameter |
Symbol |
Values |
Unit |
Note/Test Condition |
||
Min. |
Typ. |
Max. |
||||
Source-drain reverse voltage |
VSD |
- |
2.3 |
- |
V |
VGS = 0 V; IS = 8 A |
Pulsed current, reverse |
IS,pulse |
- |
- |
58 |
A |
VGS = 6 V; tPULSE = 10 µs |
Reverse recovery charge |
Qrr |
- |
0 |
- |
nC |
IS = 8 A; VDS = 400 V |
Reverse recovery time |
trr |
- |
0 |
- |
ns |
|
Peak reverse recovery current |
Irrm |
- |
0 |
- |
A |
Package outlines