YZPST-M1A080120L1
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YZPST-M1A080120L1

N-Channel SiC Power MOSFET
P/N: YZPST-M1A080120L1
Features
High Blocking Voltage with Low On-Resistance
High Speed Switching with Low Capacitance
Easy to Parallel and Simple to Drive
Benefits
Higher System Efficiency
Reduced Cooling Requirements
Increased Power Density
Increased System Switching Frequency
Applications
Power Supplies
High Voltage DC/DC Converters
Motor Drives
Switch Mode Power Supplies

Pulsed Power applications

YZPST-M1A080120L1

description1
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DESCRIPTION

N-Channel SiC Power MOSFET

P/N: YZPST-M1A080120L1

Features

High Blocking Voltage with Low On-Resistance

High Speed Switching with Low Capacitance

Easy to Parallel and Simple to Drive

Benefits

Higher System Efficiency

Reduced Cooling Requirements

Increased Power Density

Increased System Switching Frequency

Applications

Power Supplies

High Voltage DC/DC Converters

Motor Drives

Switch Mode Power Supplies

Pulsed Power applications


Part Number

Package

M1A080120 L1

TO-247-4

Maximum Ratings (TC=25℃ unless otherwise specified)

Symbol Parameter Value Unit Test Conditions Note
VDSmax Drain-Source Voltage 1200 V VGS=0V, ID=100μA
VGSmax Gate-Source Voltage -0.4 V Absolute maximum values
VGSop Gate-Source Voltage -0.25 V Recommended operational values
ID Continuous Drain Current 36 A VGS=20V, Tc=25
24 VGS=20V, Tc=100
ID(pulse) Pulsed Drain Current 80 A Pulse width t limited by TJmax
PD Power Dissipation 192 W Tc=25TJ=150
TJTSTG Operating Junction and Storage Temperature -55 to +150

Electrical Characteristics (TC=25℃ unless otherwise specified)

Symbol Parameter Min. Typ. Max. Unit Test Conditions Note
V(BR)DSS Drain-Source Breakdown Voltage 1200 / / V VGS=0V, ID=100μA
VGS(th) Gate Threshold Voltage 2 2.4 4 V VDS=VGS, ID=5mA Fig. 11
/ 1.8 / VDS=VGS, ID=5mATJ=150
IDSS Zero Gate Voltage Drain Current / 1 100 µA VDS=1200V, VGS=0V
IGSS+ Gate-Source Leakage Current / 10 250 nA VDS=0V, VGS=25V
IGSS- Gate-Source Leakage Current / 10 250 nA VDS=0V, VGS=-10V
RDS(on) Drain-Source On-State Resistance / 80 98 VGS=20V, ID=20A Fig.
/ 140 / VGS=20V, ID=20A, TJ=150 4,5,6
Ciss Input Capacitance / 1475 / VGS=0V Fig.
Coss Output Capacitance / 94 / pF VDS=1000V 15,16
Crss Reverse Transfer Capacitance / 11 / f=1MHz
Eoss Coss Stored Energy / 52 / µJ VAC=25mV
EON Turn-On Switching Energy / 564 / µJ VDS=800V, VGS=-5V/20V
EOFF Turn-Off Switching Energy / 260 / ID=20A, RG(ext)=2.5Ω, L=200μH
td(on) Turn-On Delay Time / 9.3 /
tr Rise Time / 9.5 / VDS=800V, VGS=-5V/20V, ID=20A RG(ext)=2.5Ω, RL=40Ω
td(off) Turn-Off Delay Time / 18 / ns
tf Fall Time / 7.6 /
RG(int) Internal Gate Resistance / 3.1 / Ω f=1MHzVAC=25mV
QGS Gate to Source Charge / 24 / VDS=800V
QGD Gate to Drain Charge / 15 / nC VGS=-5V/20V
QG Total Gate Charge / 79 / ID=20A

Reverse Diode Characteristics

Symbol Parameter Typ. Max. Unit Test Conditions Note
VSD Diode Forward Voltage 3.6 / V VGS=-5V, ISD=10A Fig.   8,9,10
3.3 / VGS=-5V, ISD=10A, TJ=150
IS Continuous Diode Forward Current / 44 A TC=25
trr Reverse Recover Time 35 / ns
Qrr Reverse Recovery Charge 91 / nC VR=800V, ISD=20A
Irrm Peak Reverse Recovery Current 4.5 / A

Package Dimensions

Package TO-247-4

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